8 Pin SOIC to DIP board converter

8 Pin SOIC to DIP is a converter board for packaging single chip with 8 pin SOIC (Small Outline Integrated Circuit) to the DIP (Dual In-Line Package) with the distance between pin 1 "(2.54 mm).


specifications:

• Board single chip packaging converters 8 pin SOIC to DIP.
• The distance between the pin DIP (pitch): 1 "(2:54 mm).
• Suitable for use on a bread board, pcb holes, and the 8 pin IC socket with the addition of headers with pitch 1 "(2.54 mm).
• Dimensions: 1.4 cm (L) x 1.1 cm (W) x 0.15 cm (H)