28 Pin SSOP to DIP is a converter board for packaging single chip with 28 pin SSOP (Shrink Small Outline Package) to a DIP (Dual In-Line Package) with the distance between pin 1 "(2.54 mm).
specifications:
- Single-chip packaging converter board 28 pin SSOP to DIP.
- The distance between the pin DIP (pitch): 1 "(2:54 mm).
- Suitable for use on a bread board, pcb holes, and the IC socket 28 pin header wide with a pitch with the addition of 1 "(2.54 mm).
- Dimensions: 3.6 cm (L) x 1.8 cm (W) x 0.15 cm (H)
