Heat Sink APF.
Specifications:
- Thermal Resistance: 7.05 degree C / Watt
- Thermal Impedance: 0.82 degree C-in2 / W
- Fin Matrix: 12 x 2
- Basic ingredients: Aluminum
- There is adhesive glue to attach Heat sink to IC
- Suitable for ICs with BGA, LGA, CPU, ASIC or IC packs that have flat surface area
- Dimensions: 19 x 19 x 6.3 mm
datasheet http: // zipansion • com / 18dVo
- Thermal Resistance: 7.05 degree C / Watt
- Thermal Impedance: 0.82 degree C-in2 / W
- Fin Matrix: 12 x 2
- Basic ingredients: Aluminum
- There is adhesive glue to attach Heat sink to IC
- Suitable for ICs with BGA, LGA, CPU, ASIC or IC packs that have flat surface area
- Dimensions: 19 x 19 x 6.3 mm
datasheet http: // zipansion • com / 18dVo
