Designed with Ceramic dielectric, encapsulated with high-temperature resistance PC engineering plastic, T823V is light, standing high temperature, stable, convenient installation, and better performance on the glass surface.
Technical Specs:
| Carrier Frequency | 860-960MHz |
| Communication Protocol | 18000-6B/ ISO 18000-6C (EPC Class 1 Gen 2) |
| Data ratio | Forwarding: 40～160, Returning: 10～40 Kbps |
| Memory Capacity | 2048 Bit, user-defined space |
| Storage Structure | 64 blocks, 4 bit/block (Byte/block) |
| Operating Range | > 8M(on glass, directional, by appointed equipment) |
| Tack Strength | 20N/in(clear glass surface) |
| UID Code | 8 Byte |
| Color | PC casing silk screen printing, LOGO, or painting serial number on casing |
| Encapsulation Material | Antenna Material: HF Ceramic; Casing: PC plastic |
| Dimension | 3.5×2.2×0.1(0.2 with non-setting adhesive), ±0.01 in |
| Weight | 24g |
| Erase - Write | 100,000 times |
| Data Retention | 10 years |
| Operating Temperature | -30℃ ~ +85℃ |
| Storage Temperature | -40℃ ~ +110℃ |
Applications:
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